Throughout the entire product lifecycle quality management process, Geehy considers various reliability activities, including reliability requirements, predictions, design, simulation, and testing. This covers hardware, software, packaging, wafer reliability, as well as system reliability, stability, safety, and consistency in various application scenarios.
• Industrial-grade chips comply with JEDEC, IEC 61508, IEC 60730 standards.
• Automotive-grade chips meet AEC-Q100, AEC-Q104, ISO 26262 standards.
Reliability testing includes but is not limited to the following items:
Testing Items | Testing Standards |
• Pre-Condition | • JESD22-A113 |
• THB/bHast | • JESD22-A118 |
• uHast | • JESD22-A118 |
• TCT | • JESD22-A104 |
• HTST | • JESD22-A103 |
• HTOL | • JESD22-A108 |
• LTOL (Automotive) | • JESD22-A108 |
• ELFR (Automotive) | • JESD22-A108 |
• Endurance | • JESD22-A117 |
• Data Retention | • JESD22-A117 |
• Solderability Test | • JESD22-B102 |
• HBM | • JS-001 |
• CDM | • JS-002 |
• Latch Up | • JESD78 |
• EMC | • SAE J1752/3 Other industry standards |
• Solder Ball Shear | • JESD22-B117 |
• Wire Bond Pull | • M2011 |
• Wire Bond Shear | • JESD22-B116 |
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